Semiconductor Application
QPAC 25 polyethylene carbonate and QPAC 40 polypropylene carbonate are both considered potential thermal decomposable binders for semiconductor-related applications. Both polymers can be used to adhere active materials to substrates, including pastes used in die attach applications. QPAC is an organic sacrificial binder used in metal pastes, such as copper and silver, for these electronic applications. QPAC binders ensure the structural integrity of the electrodes by binding active materials to current collectors and conductive agents, while also providing the necessary flexibility.
Key Benefits:
- Low-temperature decomposition. QPAC decomposes completely between 220°C – 350°C, which can be 100°C or more below the decomposition temperatures of other binders.
- Decomposition can occur in a wide range of atmospheres, including air, oxygen, nitrogen, hydrogen, argon, and vacuum.
- Upon decomposition, QPAC leaves less than 10 ppm ash residue, with complete carbon burnout.
- QPAC is soluble in many common solvents.
- The controlled polymer debinding process enables improved part structure and pore-size management.
- The use of QPAC binders allows for parts with excellent green strength and density.
- QPAC has excellent film-forming and coating capabilities.
Applications include:
- Fabrication of capacitors (tantalum, MLCC, LTCC, PZT, AlN)
- Die attach silver paste
- Electrode manufacturing
- 3DIC temporary adhesive
QPAC binds the following:
- Ceramic
- Metal
Give us a call (302) 225-0100 or send us an email