Close-up of a printed circuit board

Micro-Electromechanical System (MEMS) Fabrication

QPAC® is suitable as a sacrificial layer for forming encapsulated air channels in MEMS and microfluidic device fabrication.

Key benefits:

  • Decomposition advances linearly with time
  • Naturally “tacky” and provides excellent adhesion to substrates
  • Decomposition occurs in a wide range of sintering atmospheres including air, oxygen, nitrogen, hydrogen, argon, and vacuum
  • Decomposes completely between 220°C – 350°C, which can be as much as 100°C below the decomposition temperatures of other binders
  • Virtually no residue or contamination
  • Benign emissions, products of combustion are carbon dioxide and water vapor, which are non-toxic, non-flammable, and environmentally safe

Applications include:

  • MEMS microfluidic devices in polyamide (SU-8)
  • Low-Temperature Co-Fired Ceramic (LTCC) chip modules