
Micro-Electromechanical System (MEMS) Fabrication
QPAC® is suitable as a sacrificial layer for forming encapsulated air channels in MEMS and microfluidic device fabrication.
Key benefits:
- Decomposition advances linearly with time
- Naturally “tacky” and provides excellent adhesion to substrates
- Decomposition occurs in a wide range of sintering atmospheres including air, oxygen, nitrogen, hydrogen, argon, and vacuum
- Decomposes completely between 220°C – 350°C, which can be as much as 100°C below the decomposition temperatures of other binders
- Virtually no residue or contamination
- Benign emissions, products of combustion are carbon dioxide and water vapor, which are non-toxic, non-flammable, and environmentally safe
Applications include:
- MEMS microfluidic devices in polyamide (SU-8)
- Low-Temperature Co-Fired Ceramic (LTCC) chip modules
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