Empower Materials
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Electronic Passive Components / Tape Casting

QPAC polymers are ideally suited for electronic applications as processing binders for ceramic, metal, and cermet powders, supporting operations such as pressing, sintering, tape casting, and injection molding used to fabricate electronic pastes and components.

In tape casting, QPAC binders act as critical organic adhesives, holding ceramic or metal particles together while delivering strong green strength, flexibility, and consistent rheology for thin, uniform sheets. QPAC 40 is particularly valued for its structural integrity during handling, drying, and sintering, while maintaining the flexibility needed to prevent cracking or tearing of green tape.

Key electronic applications include multi-layer ceramic capacitors (MLCCs) and low temperature co-fired ceramic capacitors (LTCCs), particularly with materials such as aluminum nitride (AlN), boron nitride (BN), and silicon nitride (SiN), as well as power systems such as solid oxide fuel cells (SOFCs).

As electronic components continue to miniaturize, these enhanced burnoff properties offer a clear advantage over traditional binders such as polyvinyl butyral (PVB) and ethyl cellulose.

Key Benefits:

  • Low-temperature decomposition. QPAC decomposes completely between 220°C – 350°C, which can be 100°C or more below the decomposition temperatures of other binders.
  • Decomposition can occur in a wide range of atmospheres, including air, oxygen, nitrogen, hydrogen, argon, and vacuum.
  • Upon decomposition, QPAC leaves less than 10 ppm ash residue, with complete carbon burnout.
  • QPAC is soluble in many common solvents.
  • The controlled polymer debinding process allows for improved part structure and pore size management.
  • The use of QPAC binders allows for parts with excellent green strength and density.
  • QPAC has excellent film-forming and coating capabilities.

Applications include:

  • Fabrication of capacitors (tantalum, MLCC, LTCC, PZT, AlN)
  • Piezoelectronics
  • Semiconductors
  • Resistors
  • Packaging

QPAC binds the following:

  • ceramic
  • metal
  • glass
  • cermet
  • conductors

Binders for Electro Ceramics Overview

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