Electronic Passive Components
QPAC® polymers are ideally suited in electronic applications as a processing binder for ceramic, metal, and cermet powders, including pressing, sintering, and injection molding operations to fabricate electronic pastes and parts and tape casting.
Our binders possess superior binder burn-off characteristics compared to other binders, such as polyvinyl butyral (PVB) and ethyl cellulose.
The binders also have excellent film-forming and coating capabilities, making them an ideal choice for the tape casting process. With the trend toward the miniaturization of electronic components, these features are more important than ever.
- Low-temperature decomposition. QPAC® decomposes completely between 220°C – 350°C, which can be 100°C or more below the decomposition temperatures of other binders.
- Decomposition can occur in a wide range of atmospheres including air, oxygen, nitrogen, hydrogen, argon, and vacuum.
- Upon decomposition, QPAC® leaves less than 10 ppm ash residue with the complete burn-out of carbon.
- QPAC® is soluble in many common solvents.
- The controlled polymer debinding process allows for improved part structure and pore size management.
- The use of QPAC® binders allows for parts with excellent green strength and density.
- QPAC® has excellent film-forming and coating capabilities.
- Fabrication of capacitors (tantalum, MLCC, LTCC, PZT, AlN)
QPAC® binds the following:
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