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QPAC^® in Applications

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January 2008:
Conference on Advanced Ceramics and Composites (American Ceramics Society)
Daytona Beach, Florida US

March 2008:
CARTS USA 2008 (Electronic Components, Assemblies and Materials Association)
Albuquerque, New Mexico US

May 2008:
SID 2008 (Society for Information Display)
Los Angeles, California US

Please contact us if you would like to meet with us at any of these meetings.

QPAC^® Products in New Applications

April 17, 2004 PhysOrgForums

As a Sacrificial Material for Microfluidic Devices:

S. Metz, S. Jiguet, A. Bertsch and Ph. Renaud “Polyimide and SU-8 microfluidic devices manufactured by heat-depolymerizable sacrificial material technique” Lab Chip, 2004, 4, 114-120

As a Sacrificial Structural Adhesive for a Microelectronic wafer during processing:

As a Binder for glass powder paste for plasma and field emission displays

As a Component of sacrificial structural materials for MEMS fabrication:

As a Binder for Solid Electrolyte Film:

As Binder component of a reagent ink (containing metals and carbon nanotubes) onto a conductive substrate, for manufacture of electrolytic capacitors:

As a Binder for piezoelectric ceramic tapes:

As a Binder for diamond compacts:

As an “Ejection Layer” for a laser printing system:

As a Binder for a supercapacitor:

As a Binder for diamond powder and other superhard coatings for bearings and races:

As a Rheology Modifier for electrically conductive inks:

As a Rheology Modifier for producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells:

As a Component for producing ceramic foams:

As a highly oxygenated Binder for propellants for rocket and gas generation systems:

As a Binder for oxygen reduced niobium oxides:

As a Binder for a light weight metal-matrix composite:

As a Binder to extrude bars for glass frit sealing frames for FPDs: