Applications

QPAC^® polymers can be processed using typical thermoplastic processing techniques, including solution processing, spin casting, injection molding or extrusion. This family of copolymers has attractive performance characteristics in a variety of applications. The following shows some of the main applications for QPAC^® and its benefits. However, the list of applications goes well beyond those listed below.

Binders Applications

1. Electronic Passive Component Industry

Applications Include:

capacitors(tantulum, MLCC, LTCC), semi-conductor, resistors, packaging

QPAC^® binds the following:

ceramic/metal powder/cermet/conductors/inks

Binders for Ceramic Processing Overview

Key Benefits:

Excellent Green Strength	Tacky, High Molecular Weight, amorphous, thermoplastic, polymer, allows high density green shaped, tapes, films, and other structures.
All Sintering Atmospheres	Nitrogen, Oxygen, Argon, Vacuum (oxygen generated in debind)
Virtually No Residue / No contamination	< 10 ppm residue ash and metal
Benign Emissions	Water and CO₂
Low Temperature Clean Burnout	Onset at 220°C complete at 350°C
Controlled Debind	Polymer chain unzipping means controlled migration of debind emissions through part. Also results in excellent pore size management.