Applications

QPAC® poly(alkylene carbonate) polymers can be processed using typical thermoplastic processing techniques, including solution processing, spin casting, injection molding or extrusion. This family of copolymers has attractive performance characteristics in a variety of applications. The following shows some of the main applications for QPAC® poly(alkylene carbonate) and its benefits. However, the list of applications goes well beyond those listed below.

Binder Applications

Electronic Passive Component Industry

Applications include:

  • capacitors (tantulum, MLCC, LTCC)
  • semi-conductor
  • resistors
  • packaging

QPAC® binds the following:

  • ceramic
  • metal
  • glass
  • cermet
  • conductors

Processes include:

  • tape casting
  • pressing
  • inks / paste

Binders for Electro Ceramics Overview

Key benefits:

Excellent Green StrengthTacky, High Molecular Weight, amorphous, thermoplastic, polymer, allows high density green shaped, tapes, films, and other structures.
All Sintering AtmospheresNitrogen, Oxygen, Argon, Vacuum (oxygen generated in debind)
Virtually No Residue / No contamination< 10 ppm residue ash and metal
Benign EmissionsWater and CO2
Low Temperature Clean BurnoutOnset at 220°C complete at 350°C
Controlled DebindPolymer chain unzipping means controlled migration of debind emissions through part. Also results in excellent pore size management.

Metal Brazing Industry

Applications include:

  • automotive
  • HVAC
  • aircraft

QPAC® is used as a binder with flux in brazing solution and paste.

Binders for Brazing Overview

Key benefits:

  • compatibility with variety of filler metals
  • viscosities are custom tailored for solution or paste requirements
  • all sintering atmospheres
  • virtually no residue / no contamination
  • benign emissions
  • low temperature clean burnout
  • improved capillary action through joint

Abrasive Tool Hardening / Diamond Cutting Tool Industry

Applications include:

  • construction tools
  • cutting tools

QPAC® binds inorganic powders to metal and ceramic substrates.

Key benefits:

  • coats metal / diamond powders evenly
  • decomposition is uniform and controlled reducing the likelihood of cracks and voids in the final part
  • all sintering atmospheres
  • virtually no residue / no contamination
  • benign emissions
  • low temperature clean burnout
  • excellent as flow aid
  • excellent for granulation of fine powders

Glass Paste and Preforms/Sealing Glass Binders

Applications include:

  • Seal glass for flat panel display (OLED, LED)
  • fiber optics, glass preforms
  • other technical glass applications

QPAC® binds glass powder/frit, including joining nanotubes and phosphors to glass substrates. Great for low melt glass.

Binders for Glass Powder Overview

Key benefits:

  • QPAC® is compatible with a variety of sealing glasses and metals
  • QPAC®‘s viscosities and molecular weights can be custom-tailored for specific solution or paste requirements
  • both grades of QPAC® are naturally “tacky” and their degrees of plasticity can be adjusted as necessary
  • decomposition is complete through three phases: solid, liquid, and vapor
  • upon decomposition, QPAC® leaves very low ash residue with the complete burn-out of carbon
  • QPAC® decomposes completely between 250°C and 350°C, which can be as much as 100°C below the decomposition temperatures of other binders
  • decomposition occurs before glass melts – resulting in higher density, less residual trapped

Thick Film Paste

Applications include:

  • solar inks
  • electrode inks
  • termination inks
  • nano inks
  • other miscellaneous inks

Key benefits:

  • excellent green strength and adhesion to substrates
  • excellent viscosity control (modified by molecular weight)
  • excellent rheological properties
  • virtually no residue / no contamination
  • high printing resolution
  • technical support can be provided to help with formulation

High Purity Technical Ceramic Parts

Includes injection molded parts

Applications include:

  • energy storage devices
  • body armor
  • electronic components
  • medical parts

Key benefits:

  • virtually no residue / no contamination
  • high strength in final product
  • high density in final product
  • low temperature burnout for sensitive materials

3D Printing (ceramic paste)

Applications include:

  • temporary adhesive additive for ceramic based binder system

Key benefits:

  • virtually no residue / no contamination
  • high strength in final product
  • high density in final product
  • low temperature burnout for sensitive materials

Energy Storage / Batteries

Applications include:

  • polymer electrolyte

Key benefits:

  • confidential

Sacrificial Structure Applications

Decomposable Channel Former

Applications include:

  • MEMS microfluidic devices in polymide
  • SU-8
  • LTCC chip modules

Key benefits:

  • decomposition advances linearly with time
  • excellent adhesive to substrates
  • diffusion through cover layer
  • all sintering atmospheres
  • virtually no residue / no contamination
  • benign emissions
  • low temperature clean burnout

Pore Formers

Applications include:

  • mesoporous carbon composites
  • titanium structures
  • fuel cells
  • medical implants

Pore Formers Overview

Key benefits:

  • decompose completely by 250° – 300°C in any environment
  • amorphous thermoplastic which will solubilize completely and homogeneously
  • all sintering atmospheres
  • virtually no residue / no contamination
  • benign emissions
  • low temperature clean burnout

Medical Implants

Applications include:

  • pore former for bio formation

Key benefits:

  • confidential

Lost Foam Casting

Applications include:

  • metal castings
  • foundries
  • aluminum
  • stainless steel

Key benefits:

  • complete burnout
  • minimal carbon residue
  • all sintering atmospheres
  • virtually no residue / no contamination
  • benign emissions
  • low temperature clean burnout